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Product Detail

SMDIM-H3 Dual Interface Card Bonding Machine

  • Details

SMDIM-H3 Dual Interface Card Bonding Machine is used to bond COB module with copper wire. Machine adopts high-speed servo system and highly stable and precise spot welder with HF contravariant resistance, which is characterized with high precision, high stability and high speed.

1. The system can follow and adjust the ultrasonic parameter automatically during running.

2. There are several programs for different sizes of sheets.

3. Servo motor controls the bonding location.

4. Use advanced ultrasonic technology with high electrical current instant bonding.

5. It is easy to load plastic sheet and easy to adjust with alarm system.

6. IO monitor display if any error.

7. Machine has maximum 9units welding heads and operator can adjust the heads position. Operator can turn off some heads if change production for small format sheet.

Bonding Materials

ABS, PVC, PET, PETG, Teslin, Polycarbonate or other mixed plastic materials

Bonding Layouts

2*5, 5*5, 3*7, 3*8, 3*9, 3*10, 4*8, 4*9, 6*8, 7*8

Bonding Heads

1-8 heads

Bonding Size

A4, A3, A3+, A2

Control Method

PLC, Touch Sceen, Servo System

Air Supply

0.6MPa      50Liter/minute

Servo Precision

X    and    Y      =0.125mm

Working Efficiency

2000-6000pcs per hour depends sheet format and embedding heads quantity


220V or 380V    50/60Hz



Packing Size


Net/Gross Weight





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Two Factories: Shenzhen city and Ruian City, China

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    • +8613686849057
    • +8613088669057